We offer custom solutions to OEM manufacturers ranging from concept to full scale volume manufacturing. Our facilities include a class 100 clean room environment, lithography and thin film processing. Our high standard of quality control is ensured by a suite of metrological systems and the use of modern statistical methods which underpin all of our production processes. As an ISO 9001:2008 certified company, we ensure the highest level of quality at a consistent level..
Axetris standard capabilities
Photolithography
- Photolithography of 1 µm for up to 8" wafers
- Single or double sided alignment
- Thick resist processing (SU8, others)
- Spray coating on severe topographies
Wet Etching
- Anisotropic Silicon etching
- Glass etching
- Metal etching
Metallization
- Sputtering up to 8" wafers
Dielectric coating deposition
- Silicon oxides and nitrides by PECVD
- Oxides or nitrides by reactive sputtering
Reactive Ion Etching
- Fused Silica
- Silicon
- Silicon Nitride / Oxide
- Photoresist
Metrology and characterization
- Interferometric and tactile surface measurements
- Film thickness measurement
- Resistivity & resistance
- Optical microscopy
- Scanning electron microscopy (SEM)
Axetris special capabilities
Micro-optics
- Refractive and diffractive for micro-optical elements
Thin membranes
- Thin dielectric membranes for optics, sensors and life science applications
CMOS wafers post processing
- CMOS post processing like back side openings, metallization, thin film deposition
Lift-Off Processes
- Metallization in connection with lift off processes for electrode formation or solder pad definition. Materials include Au, Pt, AuSn, Cr, Ni, Ta, TiW, Cu, Al, other materials upon request
Dicing
- Dicing of Silicon, glass & fused silica wafers
- Dicing of chips with fragile structures such as thin membranes and micro-optic structures
Wet etching of glass
- Wet etching processes for microfluidics, optics and encapsulation