Thin film deposition processes rely on stable, reproducible and quick gas flow control for sputtering and process gases. The right mass flow product can provide critical advantages toward achieving high deposition performance.
In the coating chamber (usually held at near vacuum conditions), a number of parameters besides the gas matrix must be controlled simultaneously and accurately, e.g. temperature and pressure. Since all of these parameters are interdependent, a quick mass flow controller response time lays the foundation for high coating efficiency. Last but not least, long-term stable performance is essential in avoiding deviations in film properties over time.