Thin Film Processes


Thin film deposition processes rely on stable, reproducible and quick gas flow control for sputtering and process gases. The right mass flow product can provide critical advantages toward achieving high deposition performance.

Deposition of thin films (coatings from a few nanometers to about 100 micrometers) is a key process step in a number of industries today. Thin film processes such as Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD) are used in industries ranging from semiconductor fabrication and solar panel production to the coating of architectural glass.

Gas Flow Control: A Key Criterion for Success

Gas flow control for sputtering gases (typically Ar), process gases (O2, N2, etc.), as well as for precursors, is absolutely essential in achieving uniform film properties during thin film deposition. A highly reproducible gas flow control ensures reproducible thin film properties, thereby minimizing quality and inspection costs.


In the coating chamber (usually held at near vacuum conditions), a number of parameters besides the gas matrix must be controlled simultaneously and accurately, e.g. temperature and pressure. Since all of these parameters are interdependent, a quick mass flow controller response time lays the foundation for high coating efficiency. Last but not least, long-term stable performance is essential in avoiding deviations in film properties over time.

Advantages of the Axetris mass flow technology

Axetris mass flow solutions rely on platinum based MEMS chip technology. Combined with smart electronic and software design, they deliver key advantages for thin film applications. Thin film deposition machine manufacturers find a supportive partner in Axetris throughout the design process.