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Axetris Europe

Axetris Amerikas

Asia+Oceania

Africa+Middle East

  • Schweiz | DE / EN
  • Deutschland | DE / EN
  • Rest of the World | EN
  • Great Britain | EN
  • Canada | EN
  • USA | EN
  • Rest of the World | EN
  • 中国 | ZH / EN
  • India | EN
  • 日本 | JA / EN
  • 대한민국 | EN
  • Rest of the World | EN
  • Rest of the World | EN

Chip on TO header

Benefits
  • True black body radiation (2 to 14 μm) 
  • High emissivity 
  • Fast electrical modulation (no chopper wheel needed) 
  • High modulation depth 
  • High electrical input to optical output efficiency 
  • Low power consumption 
  • Long lifetime 
  • Rugged MEMS design (passed the requirements of IEC 60721-3-7 Class 7M3, except for BaF2 and CaF2 windows)

Technical Data

Details basic - EMIRS200 on TO39 - back vented + Add to Watchlist + Add to Comparison Print Specifications

Article No. *603.051*

Attribute Unit Value
Socket TO39
Buildup
Window
Working Temperature °C
Emissivity 0.95
Modulation depth %
Lifetime years
Cold Resistance Ω 45Ohm (35-55Ohm) *
Hot Resistance Ω 72Ohm (54-89Ohm)*
Voltage V
Current I
*
Details basic - EMIRS200 on TO39 - front vented + Add to Watchlist + Add to Comparison Print Specifications

Item added to watchlist