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Axetris special capabilities

Micro-optics
  • Refractive and diffractive for micro-optical elements

Thin membranes
  • Thin dielectric membranes for optics, sensors and life science applications

CMOS wafer post processing
  • CMOS post processing like back side openings, metallization, thin film deposition

Lift-Off Processes
  • Metallization in connection with lift off processes for electrode formation or solder pad definition. Materials include Au, Pt, AuSn, Cr, Ni, Ta, TiW, Cu, Al, other materials upon request

Dicing
  • Dicing of Silicon, glass & fused silica wafers
  • Dicing of chips with fragile structures such as thin membranes and micro-optic structures
Photolithography
  • Photolithography of 1 µm for up to 8" wafers
  • Single or double sided alignment 
  • Thick resist processing (SU8, others)
 
Wet Chemistry
  • Anisotropic Silicon etching 
  • Glass etching 
  • Metal etching
  • Wet Cleaning Processes

Plasma treatment /surface conditioning
  • Metallization
  • Sputtering up to 8" wafers 
  • Co-sputtering

Dielectric coating deposition
  • Silicon oxides and nitrides by PECVD
  • Oxides or nitrides by reactive sputtering

Reactive Ion Etching
  • Fused Silica
  • Silicon
  • Silicon Nitride / Oxide
  • Photoresist 

Metrology and characterization
  • Interferometric and tactile surface measurements 
  • Film thickness measurement 
  • Resistivity & resistance
  • Optical microscopy
  • Automatic optical inspection
  • Scanning electron microscopy (SEM)

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