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Axetris Europe

Axetris Amerikas

Asia+Oceania

Africa+Middle East

  • Switzerland | DE / EN
  • Germany | DE / EN
  • Rest of the World | EN
  • Great Britain | EN
  • Canada | EN
  • USA | EN / DE / ZH / JA
  • Rest of the World | EN
  • 中国 | ZH / EN / JA
  • India | EN
  • 日本 | JA / EN
  • 대한민국 | EN
  • Rest of the World | EN
  • Rest of the World | EN

Back-End

MOE Back-End AR Coating

AR-Coating

AR-Coating is typically applied to both sides of parts and can be optimized for glue (n=≈1.5)

 

Typical specifications are:

 

  Silicon   Fused Silica

  λ = 1250 - 1620 nm
  R>0.3% per side
  (R>0.2% typically achieved)

  λ = 1520 - 1620 nm
  R>0.2% per side
 

 

Transmission curves are measured and adhesion/abrasion tests are done for each run.

MOE Dicing

Chip Dicing (Wafer Sawing)

  Silicon
 Fused Silica
Minimum chip size
~ 0.5 x 0.5 mm
  ~ 1 x 1.5 mm
 Dicing width
 ~ 0.05 mm
  ~ 0.25 mm
 Edge position accuracy

~ ± 0.010 mm
~ ± 0.005 mm
~ ± 2 µm for DRIE

 ~ ± 0.025 mm
 Verticality

 < 1.5°
< 1.0° for DRIE

 < 1.5°
 Dicing nose
  No, or small
  Yes, ~ 30x60 µm
 Chipping  < 0.05mm rms
  < 0.15 mm rms
MOE Optical Inspection

100% Optical Inspection

front- and back-side

MOE Pick and Place

Pick & Place

Item added to watchlist