
AR-Coating
AR-Coating is typically applied to both sides of parts and can be optimized for glue (n=≈1.5)
Typical specifications are:
Silicon | Fused Silica |
λ = 1250 - 1620 nm |
λ = 1520 - 1620 nm |
Transmission curves are measured and adhesion/abrasion tests are done for each run.

Chip Dicing (Wafer Sawing)
Silicon |
Fused Silica |
|
Minimum chip size |
~ 0.5 x 0.5 mm |
~ 1 x 1.5 mm |
Dicing width |
~ 0.05 mm |
~ 0.25 mm |
Edge position accuracy |
~ ± 0.010 mm |
~ ± 0.025 mm |
Verticality |
< 1.5° |
< 1.5° |
Dicing nose |
No, or small |
Yes, ~ 30x60 µm |
Chipping | < 0.05mm rms |
< 0.15 mm rms |

100% Optical Inspection
front- and back-side
