Axetris offers processing services on customer supplied and pre-processed 150 and 200mm wafers. Processes include patterning of silicon or glass substrates by wet- and/or dry etching, including membranes or cavities, as well as metal or dielectric coating deposition and patterning. A wide range of metrology, characterisation and inspection can be provided, as well as dicing and die sorting.
Technical Data
Metric
Imperial
Max. Wafer size
200 mm
Photolithography
Down to 1µm; single/double-sided; thick resists; also on existing topographies
Metallization
Cr, Al, TiW, Ta, Pt, Au, AuSn, others on request
Patterned metallization
As marks, masking, electrodes, solder pads etc.
Dry etching
Silicon, Fused silica, Silicon nitride or oxide, photoresist, others on request
Wet etching
Anistropic Silicon-etching, Glass etching, Metal etching
Dielectric coatings
Silicon nitride, silicon oxide
Membranes
Thin dielectric membranes for sensing, life-science or MEMS applications
Micro-optics
Refractive and diffractive optical elements
Metrology/characterization
Surface measurements; film thickness, resistance and resistivity measurements
Inspection and microscopy
Optical inspection and microscopy; SEM microscopy with EDX element analysis
Dicing
Silicon, glass and fused silica; also with delicate features such as eg. membranes
